Download Reliability of Microtechnology: Interconnects, Devices and by Johan Liu, Visit Amazon's Olli Salmela Page, search results, PDF

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By Johan Liu, Visit Amazon's Olli Salmela Page, search results, Learn about Author Central, Olli Salmela, , Jussi Sarkka, James E. Morris, Per-Erik Tegehall, Cristina Andersson

Reliability of Microtechnology discusses the reliability of microtechnology items from the ground up, starting with units and increasing to structures. The book's concentration comprises yet isn't restricted to reliability problems with interconnects, the method of reliability strategies and basic failure mechanisms. particular failure modes in solder and conductive adhesives are mentioned at nice size. assurance of sped up trying out, part and approach point reliability, and reliability layout for manufacturability also are defined in detail.The ebook additionally comprises workouts and precise ideas on the finish of every bankruptcy.

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In the assessment of reliability performance of a microstructure, the stress distribution, the strain amplitude, the strain rate, the cyclic nature of the stress (either mechanical or thermal), the temperature, and other environmental factors all have to be considered. Basic processes or factors that are believed to be probable reasons for solder failure while in service are inferior or of inadequate mechanical strength, creep, mechanical and/or thermal fatigue, thermal expansion anisotropy, corrosionenhanced fatigue, intermetallic compound formation, detrimental microstructure development, voids, electromigration, and leaching.

IPC-T-50G, “Terms and Definitions for Interconnecting and Packaging Electronic circuits”. Standard by IPC, Lincolnwood, IL, 2003, 37. 2. RIAC, “Handbook of 217PlusTM Reliability Prediction Models”, Department of Defense, USA, 2006, 146. 3. W. Brown, “Advanced Electronic Packaging with Emphasis on Multichip Modules”, IEEE Press Series on Microelectronic Systems, 1999. 4. R. Wassink and M. Verguld, “Manufacturing Techniques for Surface Mounted Assemblies”, Electrochemical Publications LTD, Bristol, 1995, 270.

21. J. Galloway, L. Li, R. Dunne and H. Tsubaki, “Analysis of Acceleration Factors Used to Predict BGA Solder Joint Field Life”, Proc. SMTA International, Chicago, 2001, 357–363. 22. M. S. Moosa and K. F. Poole, “Simulating IC Reliability with Emphasis on Process-Flaw Related Early Failures”, IEEE Transactions on Reliability, 44, 1995, 556–561. 23. E. Demko, “Commercial-Off-The-Shelf (COTS): A Challenge to Military Equipment Reliability”, Proc. Annual Reliability and Maintainability Symposium, Las Vegas, NV, 1996, 7–12.

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