Download MEMS mechanical sensors by Stephen Beeby; et al PDF

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By Stephen Beeby; et al

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2 Simulink model of the entire sensor system. The model includes the sensing element dynamics, conversion from displacement to differential capacitance and, in turn, to a voltage, sigma-delta modulator control blocks, and the force-feedback arrangements. 42 MEMS Simulation and Design Tools electrodes is energized. These feedback forces are summed with any external inertial force acting on the proof mass. The model allows the optimization of many design parameters such as the electrode area, spring constant, proof mass, the required electronic pick-off gain, and the sampling frequency.

The dry etch process that can achieve this is called DRIE and there are currently two different processes being used by equipment manufacturers. In each case the deep anisotropy is achieved by passivation of the sidewalls of the trench as it is etched. One process uses cryogenic cooling of the wafer to liquid nitrogen temperatures, which, it is believed, causes condensation of the reactant gases on to the silicon surface, thus passivating it. On horizontal surfaces, such as the bottom of trenches, this condensate is removed by ion bombardment and these surfaces are therefore etched.

Turner, “Thick-Film Sensors: Past, Present and Future,” Measurement Science and Technology, Vol. 8, No. 1, 1997, pp. 1–20. , “Low-Cost Post-CMOS Integration of Electroplated Microstructures for Inertial Sensing,” Sensors and Actuators, Vol. A83, 2000, pp. 93–100. , “Microfluidic Components for Biological and Chemical Microreactors,” Proc. of 10th Annual Workshop of Micro Electro Mechanical Systems (MEMS ’97), Nagoya, Japan, January 26–30, 1997, pp. 338–343. , “MOEMS Fabricated by the LIGA Technique—An Overview,” Proc.

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