By Henry Baltes, Oliver Brand, Gary K. Fedder, Christofer Hierold, Visit Amazon's Jan G. Korvink Page, search results, Learn about Author Central, Jan G. Korvink, , Osamu Tabata
Microstructures, electronics, nanotechnology - those great fields of analysis are starting to be jointly because the dimension hole narrows and plenty of assorted fabrics are mixed. present study, engineering sucesses and newly commercialized items trace on the massive leading edge potentials and destiny purposes that open up as soon as mankind controls form and serve as from the atomic point correct as much as the obvious global with none gaps.Sensor structures, microreactors, nanostructures, nanomachines, practical surfaces, built-in optics, monitors, communications expertise, biochips, human/machine interfaces, prosthetics, miniaturized clinical and surgical procedure apparatus and lots of extra possibilities are being explored.This new sequence, complex Micro & Nanosystems, presents state of the art experiences from best authors on applied sciences, units and complex platforms from the micro and nano worlds.
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Extra info for Enabling Technologies for MEMS and Nanodevices (Advanced Micro and Nanosystems)
5 Commercial Infrastructure Surface micromachining provided a different angle to making mechanical structures from the early bulk structures. More recently, combination bulk and surface parts promise more flexibility in device design and better performance. The bulk characteristics can be used to increase signal level and structural integrity and surface processes to achieve tight control of small-dimensional structures and compound suspensions or elements. Deep reactive ion etching (DRIE) has also added another level of complexity and capability to MEMS fabrication.
Vol. 1 Edited by H. Baltes, O. Brand, G. K. Fedder, C. Hierold, J. Korvink, O. Tabata Copyright © 2004 WILEY-VCH Verlag GmbH & Co. 1 Introduction MEMS technology has gone through many phases of naming. In its early days, it was primarily referred to as silicon micromachining, making mechanical structures in silicon and a number of early acronyms. All referred to the basic concept that the silicon manufacturing technology that was being used at the time to great advantage in signal processing could be used to the same advantage to make mechanical structures.
Handling during assembly has also added cost. Other devices have used fused links. More recently, co-integrated MEMS with built-in EEPROM or electrical programming have provided a very attractive alternative. In many cases, the calibration and compensation cost exceeds the cost of the MEMS device. It can also be the cause of major yield loss and reduced reliability. The overall goal is to accomplish calibration and compensation using low-cost, reliable standard IC assembly techniques. Most current MEMS packaging and assembly have evolved to meet these requirements.