By Ken Gilleo
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Extra info for Area Array Packaging Handbook: Manufacturing and Assembly
The business structure of the industry is evolving rapidly. Unlike a decade ago, when companies such as IBM manufactured most critical components in-house, systems manufacturers increasingly rely on component and materials suppliers for enabling technology advances to deliver better systems performance at lower cost. Despite this growing significance, materials and component manufacturers typically remain hidden behind the systems cover, with the one notable exception of the Intel Inside branding success.
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Since the conductors fan in, the package is much smaller than the equivalent TAB style. The flex-CSP can be surface mounted instead of using a specialized TAB bonder. Both the TBGA and micro-CSP are successful. 17 Flex BGA. 1 Lead Frame As suggested earlier, metal lead frames can only be used for perimeter-type packages and will only be mentioned in this book for reference purposes. 2 Chip Carriers/Platforms Chip carriers are necessary for area array packages, but they also can be designed as perimeter-only packages.