By K. L. Mittal, Tanweer Ahsan
This accomplished e-book will supply either basic and utilized elements of adhesion concerning microelectronics in one and simply obtainable resource. one of the themes to be coated include;
- Various theories or mechanisms of adhesion
- Surface (physical or chemical) characterization of fabrics because it relates to adhesion
- Surface cleansing because it relates to adhesion
- Ways to enhance adhesion
- Unraveling of interfacial interactions utilizing an array of pertinent techniques
- Characterization of interfaces / interphases
- Polymer-polymer adhesion
- Metal-polymer adhesion (metallized polymers)
- Polymer adhesion to varied substrates
- Adhesion of skinny films
- Adhesion of underfills
- Adhesion of molding compounds
- Adhesion of alternative dielectric materials
- Delamination and reliability matters in packaged devices
- Interface mechanics and crack propagation
- Adhesion dimension of skinny movies and coatings
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This accomplished e-book will offer either basic and utilized facets of adhesion relating microelectronics in one and simply available resource. one of the subject matters to be coated include;Various theories or mechanisms of adhesionSurface (physical or chemical) characterization of fabrics because it relates to adhesionSurface cleansing because it relates to adhesionWays to enhance adhesionUnraveling of interfacial interactions utilizing an array of pertinent techniquesCharacterization of interfaces / interphasesPolymer-polymer adhesionMetal-polymer adhesion (metallized polymers)Polymer adhesion to varied substratesAdhesion of skinny filmsAdhesion of underfillsAdhesion of molding compoundsAdhesion of alternative dielectric materialsDelamination and reliability concerns in packaged devicesInterface mechanics and crack propagationAdhesion size of skinny motion pictures and coatings
Extra resources for Adhesion in Microelectronics
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